Abstract submission

THERMINIC is the major European Workshop related to thermal issues in electronic components and systems. We invite delegates to consider submitting abstracts that are related (but not limited) to the following topics in thermal or thermo-mechanical aspects in simulation and experiment.

If you are interested in presenting a paper or a poster at the conference, please submit an abstract of close to, but not exceeding, two pages through our online system. The deadline for abstract submission has been extended to May 14, 2023.

Abstracts must be submitted in PDF format and detail the objectives of the work presented and demonstrate new results. The corresponding template can be downloaded from this page. All abstracts will undergo a double-blind review process. There will be best paper and best poster awards.

Accepted papers will be submitted for inclusion into IEEE Xplore subject to meeting IEEE Xplore’s scope and quality requirements. THERMINIC papers can be searched through IEEE, Google scholar and other search engines.


Call for papers (1 MB/ .pdf)

Abstract Template (160 KB/.docx)

Submit your abstract here


Thermal Phenomena in Simulation & Experiment:

  • Thermal management of electronic components and systems
  • Classical and modern thermometry and thermography
  • Thermal interface materials and their characterisation
  • Thermal modelling and investigation of packages
  • Nano-scale heat transfer
  • Multi-physics simulation and field coupling
  • Electro-thermal modelling and simulation
  • CFD modelling and benchmarking
  • Advanced thermal materials and technologies
  • Numerical methods for multi-scale heat transfer
  • Use of novel, advanced mathematics and statistics concepts / AI methods for complex digital twins of components and systems

Electronics Cooling Concepts &  Applications:

  • Cooling concepts: air, liquid, 2-phase, etc.
  • Power electronics
  • High temperature electronics
  • Solid state lighting: LED packages and LED based lighting solutions
  • Thermo-electric and sub-ambient cooling
  • Novel and advanced cooling technologies
  • Heat pipe and vapor chambers,
  • 3D heterogenous integration and cooling, ultra low form factor air cooling
  • Novel manufacturing methods
  • Cooling for IoT, CPS, mobile, edge computing
  • Thermal buffering for computational sprinting
  • Battery thermal management


Thermo-Mechanical Reliability

  • Thermo-mechanical reliability
  • Prognostics and health monitoring
  • Lifetime modelling and prediction
  • Damage and fracture mechanics
  • Failure analysis and inline inspection

and any cross-topic from these major areas.

DEADLINES & Submissions

Abstract submission: Closed
Notification of acceptance: 24th June 2023
Submission of paper for proceedings: 8th August 2023


Don´t miss important dates, deadlines and announcements with the Therminic Newsletter.