THERMINIC 2023 – a resounding success!
Budapest / September 27 – 29, 2023
The 29th International Workshop on Thermal Investigation of ICs and Systems (Therminic 2023) marked another milestone in the research of thermal issues in electronic components.
The three-day-event in Budapest, Hungary, was attended by more than 110 conference delegates from 13 different countries, with a wide range of backgrounds in technology development and industrial management. Together they contributed three keynotes, 39 oral presentations and 22 posters, a short course preceding the workshop and their vast know-how and experience during the sessions and networking events.
A true highlight was the late-summer cruise on the Danube, combining Hungarian cuisine with the stunning views of the illuminated Budapest skyline under a full moon – a spectacular backdrop for discussions of the day’s presentations and for networking in a relaxed atmosphere.
We congratulate the winners of this year’s Best Paper Award, Nils J. Ziegeler and his colleagues for their work on “Tridiagonal Approaches for Network Identification by Deconvolution”, as well as Artur Jurkowski and his colleagues for the best poster of the conference (“Thermal Challenges in Design of Data Processing Electronics for Cubesats”). This year’s best young researcher award goes to David Walther for his paper on “Development and Evaluation of a Belt Drive Fatigue Tester for Accelerated Thermo-mechanical Stress Testing of Thin Metallic Films on Flexible Substrates” – well done, everyone! The awards were presented by the representative of the awards sponsor, Vadim Tsoi from Huawei. Details about the awards recipients can be found here.
The organisers would like to thank our keynote speakers and all the presenters, session chairs, exhibitors and sponsors for their contribution to this exciting event. We hope to see you all again at THERMINIC 2024 in Toulouse.
Prof. András Poppe
Therminic 2023 Programme Chair
Pictures by Wendy Luiten and Genevieve Martin
Don´t miss important dates, deadlines and announcements with the Therminic Newsletter.